Flagship product · Made in Germany

SONIQMegasonic Cleaning System

High-frequency acoustic innovation meets German engineering precision. Uniform, damage-free wafer cleaning for the world's most demanding semiconductor applications.

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99%+
Particle removal efficiency
↓ Cycle
Reduced process time
24/7
Continuous operation
Made DE
Assembled in Stockach
The SONIQ advantage

Why choose SONIQ?

Uniform acoustic coverage

Engineered to deliver consistent megasonic energy from wafer center to edge — ensuring reliable, repeatable results across every run, every substrate.

Structure integrity preserved

Advanced frequency control protects even the most delicate structures. Sub-micron particles removed without mechanical damage to features or films.

Modular & maintainable

Service-first design means components are easy to access, replace, and upgrade — minimising downtime and protecting your production schedule.

German-assembled quality

Every SONIQ unit is assembled and tested in Stockach, Germany — giving you traceable quality control and the reliability of German engineering standards.

Technology

How megasonic cleaning works

SONIQ uses controlled high-frequency acoustic energy transmitted through a liquid medium to remove particle contamination — without chemicals, without abrasion.

  • 01

    Acoustic energy generation

    A piezoelectric transducer generates high-frequency sound waves at 1, 2, and 3 MHz, transmitted uniformly through the process liquid.

  • 02

    Cavitation & streaming

    Controlled acoustic streaming and micro-cavitation dislodge sub-micron particles from the wafer surface — gently and uniformly across the entire substrate.

  • 03

    Particle transport & removal

    Dislodged particles are carried away by the flowing liquid, preventing re-deposition and ensuring consistently high particle removal efficiency.

Megasonic cavitation bubbles — SONIQ cleaning process
Applications

Where SONIQ excels

Semiconductor

Front-end wafer cleaning, post-CMP, photoresist removal. Compatible with leading process chemistries.

MEMS

Gentle removal of particles from micro-electromechanical structures without disturbing fragile features.

Precision optics

Contamination-free cleaning of optical substrates, lenses, and coated surfaces to sub-micron cleanliness.

Technical specifications

System specifications

Operating frequencies1, 2 & 3 MHz
Particle removal efficiency>99% (≥50nm particles)
Substrate compatibilitySi, SiO₂, III-V, Glass, Sapphire
Chemical compatibilitySC1, SC2, DHF, DIW, IPA
OperationContinuous 24/7
DesignModular — scalable configurations
OriginDesigned & assembled in Germany
CertificationCE marked
Request full datasheet
Semiconductor wafer — SONIQ compatible substrates

Ready to see SONIQ in action?

Contact our team to arrange a demonstration or discuss your specific cleaning process requirements.

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