High-frequency acoustic innovation meets German engineering precision. Uniform, damage-free wafer cleaning for the world's most demanding semiconductor applications.
Engineered to deliver consistent megasonic energy from wafer center to edge — ensuring reliable, repeatable results across every run, every substrate.
Advanced frequency control protects even the most delicate structures. Sub-micron particles removed without mechanical damage to features or films.
Service-first design means components are easy to access, replace, and upgrade — minimising downtime and protecting your production schedule.
Every SONIQ unit is assembled and tested in Stockach, Germany — giving you traceable quality control and the reliability of German engineering standards.
SONIQ uses controlled high-frequency acoustic energy transmitted through a liquid medium to remove particle contamination — without chemicals, without abrasion.
A piezoelectric transducer generates high-frequency sound waves at 1, 2, and 3 MHz, transmitted uniformly through the process liquid.
Controlled acoustic streaming and micro-cavitation dislodge sub-micron particles from the wafer surface — gently and uniformly across the entire substrate.
Dislodged particles are carried away by the flowing liquid, preventing re-deposition and ensuring consistently high particle removal efficiency.
A megasonic system is only as good as the energy it puts into the liquid. The transducer converts that energy; the generator decides exactly how much, at which frequency, and how tightly it is held. Both halves of SONIQ are developed and built by DTEC, so they are tuned to each other rather than matched after the fact.
SONIQ 100 Flex — 100 W, switchable 465 / 925 kHz, built in Stockach
Front-end wafer cleaning, post-CMP, photoresist removal. Compatible with leading process chemistries.
Gentle removal of particles from micro-electromechanical structures without disturbing fragile features.
Contamination-free cleaning of optical substrates, lenses, and coated surfaces to sub-micron cleanliness.
| Operating frequencies | 1, 2 & 3 MHz |
| Particle removal efficiency | >99% (≥50nm particles) |
| Substrate compatibility | Si, SiO₂, III-V, Glass, Sapphire |
| Chemical compatibility | SC1, SC2, DHF, DIW, IPA |
| Operation | Continuous 24/7 |
| Design | Modular — scalable configurations |
| Origin | Designed & assembled in Germany |
| Certification | CE marked |
Contact our team to arrange a demonstration or discuss your specific cleaning process requirements.
Request a demo